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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9393755 B1

PDFFull Text
Date of Patent:
Jul. 19, 2016

Filed:

Mar. 24, 2015

Multilayered heat-recoverable article, wire splice, wire harness, and method for producing adhesive for multilayered heat-recoverable article

Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Fine Polymer, Inc., Sennan-gun, Osaka, JP;

Inventors:

Ryota Fukumoto, Osaka, JP;

Satoshi Yamasaki, Osaka, JP;

Yasutaka Emoto, Osaka, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, JP;

SUMITOMO ELECTRIC FINE POLYMER, INC., Sennan-gun, Osaka, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

Michael C Miggins

Int. Cl.
CPC ...
B32B 1/08 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/34 (2006.01); H02G 3/04 (2006.01); H02G 15/18 (2006.01); H01B 17/58 (2006.01); H01B 3/18 (2006.01); H02G 15/04 (2006.01);
U.S. Cl.
CPC ...
B32B 1/08 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/34 (2013.01); H01B 3/18 (2013.01); H01B 17/58 (2013.01); H02G 3/0462 (2013.01); H02G 3/0481 (2013.01); H02G 15/043 (2013.01); H02G 15/1806 (2013.01); B32B 2307/736 (2013.01);
Abstract

An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article () according to the present invention includes a cylindrical base material layer (), and an adhesive layer () formed on an inner circumferential surface of the base material layer. The adhesive layer () is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer () at 150° C. is 300 Pa·s or more at a shear rate of 0.01 sand 200 Pa·s or less at a shear rate of 100 s. The wire splice and the wire harness according to the present invention includes a tube formed by thermally shrinking the multilayered heat-recoverable article ().

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