The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Dec. 07, 2011
Applicants:
Teruo Matsutani, Shiga, JP;
Yasutaka Kondo, Shiga, JP;
Hisayasu Kaneshiro, Shiga, JP;
Inventors:
Assignee:
KANEKA CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/32 (2006.01); C08L 79/08 (2006.01); B32B 27/28 (2006.01); C08G 73/10 (2006.01); B29C 47/06 (2006.01); B29K 79/00 (2006.01); H05K 1/03 (2006.01); B29C 47/00 (2006.01);
U.S. Cl.
CPC ...
B29C 41/32 (2013.01); B32B 27/281 (2013.01); C08G 73/105 (2013.01); C08G 73/1042 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08L 79/08 (2013.01); B29C 47/0021 (2013.01); B29C 47/065 (2013.01); B29K 2079/08 (2013.01); B29K 2079/085 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); H05K 1/036 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0154 (2013.01);
Abstract
In the present invention, (i) a polyamic acid solution for forming a thermoplastic polyimide layer to be in no contact with a support contains no chemical dehydrating agent or imidization catalyst, (ii) a polyamic acid solution for forming a thermoplastic polyimide layer to be in contact with the support contains an imidization catalyst, and (iii) a polyamic acid solution for forming a non-thermoplastic polyimide layer contains a chemical dehydrating agent and an imidization catalyst. This arrangement eliminates a property difference between the thermoplastic polyimide layers.