The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Feb. 11, 2014
Applicant:

Lockheed Martin Corporation, Bethesda, MD (US);

Inventors:

Matthew William Kelley, Orlando, FL (US);

David Patrick Summerlot, Orlando, FL (US);

Joseph Michael Turchiano, Orlando, FL (US);

Assignee:

LOCKHEED MARTIN CORPORATION, Bethesda, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 9/00 (2006.01); H05K 3/46 (2006.01); G06K 19/073 (2006.01);
U.S. Cl.
CPC ...
H05K 9/00 (2013.01); G06K 19/073 (2013.01); H05K 3/46 (2013.01); H05K 7/2039 (2013.01);
Abstract

A security wrapper for an electronic assembly and methods for forming such a wrapper are provided. A first wrap layer and/or a second wrap layer may be made from a curable adhesive material. A flexible layer is interposed between the first and second wrap layers, which in combination constitute a pre-formed wrapper in an uncured condition. The pre-formed wrapper may be mounted onto an electronic assembly including circuit components having respective three-dimensional profiles which can vary over a surface of the electronic assembly. The pre-formed wrapper may be subjected to a curing process so that in a cured condition conformable adherence is provided with respect to the circuit components. This arrangement provides a thermal coupling effective to dissipate heat produced by such circuit components and further results in a low-profile for the assembly of the wrapper and electronic assembly.


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