The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Feb. 07, 2014
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Yoshimichi Hara, Kuwana, JP;

Toshihisa Yamamoto, Anjo, JP;

Takahiro Yamanaka, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 11/00 (2016.01); H02K 9/10 (2006.01); H02K 5/22 (2006.01); H05K 7/20 (2006.01); H02K 9/22 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H02K 5/22 (2013.01); H02K 9/22 (2013.01); H02K 11/33 (2016.01); H05K 7/20854 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern. A resin body is wrapped around the semiconductor chip. A first metal plate has a side connected to the semiconductor chip and an other side connected to the first circuit pattern. A radiator projects toward and is connected to the first circuit pattern by a first heat conductor. As a result, heat generated by the semiconductor chip is transmitted to the radiator through the first metal plate, the first circuit pattern, and the first heat conductor during operation of the semiconductor module.


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