The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Oct. 16, 2013
Applicant:

Outlast Technologies Llc, Golden, CO (US);

Inventors:

Mark Hartmann, Boulder, CO (US);

Greg Roda, Broomfield, CO (US);

Assignee:

OUTLAST TECHNOLOGIES, LLC, Golden, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 3/30 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); G06F 1/203 (2013.01); H05K 3/30 (2013.01); H05K 7/20454 (2013.01); Y10T 29/49146 (2015.01);
Abstract

An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.


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