The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Dec. 01, 2011
Applicants:

Kazuhiro Nakajima, Ibaraki, JP;

Tomotake Nashiki, Ibaraki, JP;

Hideo Sugawara, Ibaraki, JP;

Inventors:

Kazuhiro Nakajima, Ibaraki, JP;

Tomotake Nashiki, Ibaraki, JP;

Hideo Sugawara, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 1/02 (2006.01); G06F 3/044 (2006.01); G06F 3/045 (2006.01); H03K 17/96 (2006.01); C08J 7/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); C08J 7/045 (2013.01); G06F 3/044 (2013.01); G06F 3/045 (2013.01); H03K 17/962 (2013.01); H03K 17/9645 (2013.01); C08J 2367/02 (2013.01); C08J 2461/28 (2013.01); C08J 2491/00 (2013.01);
Abstract

The present invention provides a transparent conductive film in which occurrence of scratches during sliding is suppressed even when transparent conductive layer forming surfaces are so arranged as to face each other. Provided is a transparent conductive film comprising a transparent film base; at least one dielectric layer formed on a first main surface of the transparent film base; and a transparent conductive layer formed on the dielectric layer, wherein the transparent conductive layer is patterned; and the surface on the first main surface of the transparent conductive film has an arithmetical mean roughness Ra of 22 nm or more, and has 140/mmor more of protrusions having heights of 250 nm or higher at a pattern-opening part in which the transparent conductive layer is not formed.


Find Patent Forward Citations

Loading…