The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Nov. 26, 2014
Applicant:

Elite Material Co., Ltd., Taoyuan County, TW;

Inventors:

Ming-Chuan Chang, Taoyuan County, TW;

Li-Chih Yu, Taoyuan County, TW;

Yu-Te Lin, Taoyuan County, TW;

Assignee:

ELITE MATERIAL CO., LTD., Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 3/08 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/024 (2013.01); H01P 3/082 (2013.01); H05K 1/025 (2013.01); H05K 1/0242 (2013.01); H05K 1/0245 (2013.01); H05K 1/0298 (2013.01); H05K 1/0353 (2013.01);
Abstract

A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.


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