The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

May. 18, 2015
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza (MB), IT;

Inventors:
Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H04B 10/40 (2013.01); H04B 10/70 (2013.01); H04B 10/50 (2013.01); H05K 3/30 (2006.01); H04B 10/80 (2013.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); H04B 10/503 (2013.01); H04B 10/70 (2013.01); H04B 10/801 (2013.01); H05K 3/30 (2013.01); Y10T 29/49131 (2015.01);
Abstract

An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.


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