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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9391183 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Mar. 26, 2015

Semiconductor device

Applicant:

Sanken Electric Co., Ltd., Niiza-Shi, Saitama, JP;

Inventors:

Satoshi Kawashiri, Niiza, JP;

Kazuko Ogawa, Niiza, JP;

Assignee:

Sanken Electric Co., Ltd., Niiza-shi, JP;

Attorney:

Mots Law, PLLC

Primary Examiner:

Jarrett Stark

Assistant Examiner:

Bitew Dinke

Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/739 (2006.01); H01L 21/28 (2006.01); H01L 29/41 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 21/28 (2013.01); H01L 29/0692 (2013.01); H01L 29/41 (2013.01); H01L 29/417 (2013.01); H01L 29/423 (2013.01); H01L 29/4236 (2013.01); H01L 29/4238 (2013.01); H01L 29/42304 (2013.01); H01L 29/42368 (2013.01); H01L 29/42376 (2013.01); H01L 29/78 (2013.01); H01L 29/1095 (2013.01); H01L 29/41708 (2013.01);
Abstract

A semiconductor device is disclosed that comprises semiconductor regions and an insulating film. A groove extends from a top surface of a semiconductor region and reaching a semiconductor region. In plan view, a body of a bottom electrode is formed in a strip form, and extends in an extending direction of the groove, and the connection portion extends in a depth direction of the groove and is connected to an end of the body in the extending direction of the body. The body of the bottom electrode is arranged in the groove, and the connection portion of the bottom electrode is arranged in the connection groove. In plan view, a length of the groove in the extending direction of the groove is larger than a width of the groove, and the width of the groove is larger than a gap between the groove and an adjacent groove.

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