The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Jun. 07, 2013
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Nam Seok Oh, Seoul, KR;

Young Jun Cho, Seoul, KR;

Kwang Kyu Choi, Seoul, KR;

Young Min Moon, Seoul, KR;

Sun Mi Moon, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 27/15 (2006.01); H01L 33/48 (2010.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 33/647 (2013.01); H01L 25/0753 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/3025 (2013.01);
Abstract

One embodiment comprises first and second light-emitting chips, each comprising: a package body having a cavity; first to fourth lead frames disposed inside the package body; a first semiconductor layer; an active layer; and a second semiconductor layer and emitting light of a different wavelength from each other, wherein each of the first to fourth lead frames comprises: an upper surface part exposed to the cavity; and a side surface part bent from one side portion of the upper surface part and exposed by one surface of the package body. In addition, the first light-emitting chip is disposed on the upper surface part of the first lead frame, and the second light-emitting chip is disposed on the upper surface part of the third lead frame.


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