The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Feb. 01, 2013
Applicants:

Kenji Imazu, Saitama, JP;

Yuzuru Wada, Yamanashi, JP;

Inventors:

Kenji Imazu, Saitama, JP;

Yuzuru Wada, Yamanashi, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 25/0756 (2013.01); H01L 33/507 (2013.01); H01L 33/60 (2013.01); H01L 33/46 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2224/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01322 (2013.01);
Abstract

The purpose of the present invention is to provide a double-sided light emitting type semiconductor light emitting device that can be easily fabricated even if a semiconductor light emitting element is flip-chip mounted, and to provide a fabrication process for the same. The semiconductor light emitting device has a plurality of lead frames, a plurality of semiconductor light emitting elements connected to the plurality of lead frames, and a covering member that covers the plurality of semiconductor light emitting elements. The semiconductor light emitting device is characterized in that the edge of one lead frame among the plurality of lead frames is disposed in close proximity to the edge of another lead frame so as to form a gap, and the plurality of semiconductor light emitting elements are flip-chip mounted on the front surface and rear surface of the one lead frame and the other lead frame so as to straddle the gap.


Find Patent Forward Citations

Loading…