The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Jul. 30, 2014
MK Electron Co., Ltd., Gyeonggi-do, KR;
Jeong Tak Moon, Gyeonggi-do, KR;
Jae Yeol Son, Gyeonggi-do, KR;
Santosh Kumar, Gyeonggi-do, KR;
Eung Jae Kim, Daegu, KR;
Hui Joong Kim, Seoul, KR;
Ho Gun Cha, Daejeon, KR;
MK Electron Co., Ltd., , KR;
Abstract
A solder ball and a semiconductor device using the same are provided. In a Sn-based solder ball in which a first plating layer and a second plating layer are sequentially formed on a core ball, the second plating layer includes a Sn—Ag—Cu alloy, and AgSn intermetallic compound (IMC) nanoparticles or Ag—Sn compound nanoparticles exist in the second plating layer. The solder balls have high sphericity and stand-off characteristics and connection reliability so that a semiconductor device having a high degree of integration may be implemented.