The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Dec. 23, 2013
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Seoul National University R&db Foundation, Seoul, KR;
Jong Hoon Kim, Suwon-si, KR;
Jae Hyun Son, Gwangju-si, KR;
Byoung Do Lee, Incheon, KR;
Kuk Jin Chun, Seoul, KR;
Woong Kyu Choi, Seoul, KR;
SK hynix, Inc., Icheaon-si, Gyeonggi-do, KR;
Abstract
The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality of first and second through electrodes that pass through the semiconductor chip body and one ends thereof are electrically connected to the bonding pads, an insulating layer formed over the second surface of the semiconductor chip body such that the other ends of the first and second through electrodes are not covered by the insulating layer, and a first heat spreading layer formed over the insulating layer.