The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
May. 29, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventors:
Soo Young Ji, Suwon-Si, KR;
Seung Hwan Kim, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01B 3/30 (2006.01); H05K 1/03 (2006.01); C09K 19/54 (2006.01); C08K 3/20 (2006.01); C08L 63/00 (2006.01); C08L 63/04 (2006.01); C08L 67/03 (2006.01); C09K 19/38 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); C09K 19/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08K 3/20 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); C08L 67/03 (2013.01); C09K 19/3809 (2013.01); H01L 25/105 (2013.01); C09K 2019/521 (2013.01); H01L 23/3128 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Disclosed herein are a molding composition for a semiconductor package including a liquid crystal thermosetting polymer resin and graphene oxide to thereby effectively decrease coefficient of thermal expansion (CTE) and warpage and maximize an effect of thermal conductivity, and a semiconductor package using the same.