The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Aug. 06, 2014
Semiconductor module including a terminal embedded in casing wall and bent over thick portion of lid
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Tomofumi Oose, Matsumoto, JP;
FUJI ELECTRIC CO, LTD., Kawasaki-Shi, JP;
Abstract
Aspects of the invention provide a semiconductor module that can be manufactured without using a bending jig for bearing the stress in bending process of the terminal and scarcely generates cracks in the resin parts of the semiconductor module. In some aspects of the invention, a semiconductor module can include a casing made of a resin material accommodating a semiconductor chip, a terminal one end of which is electrically connected to the semiconductor chip and the other end of which is projecting out of the casing and bent and a lid made of a resin material fitted on an opening of the casing, a part of end region of the lid being in contact with the terminal and being a thick part with a thickness thicker than a thickness of other parts of the lid.