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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9390955 B1

PDFFull Text
Expired
Date of Patent:
Jul. 12, 2016

Filed:

Aug. 19, 2015

Handle substrate and composite wafer for semiconductor device

Applicant:

Ngk Insulators, Ltd., Aichi-prefecture, JP;

Inventors:

Tatsuro Takagaki, Nagoya, JP;

Yasunori Iwasaki, Kitanagoya, JP;

Sugio Miyazawa, Kasugai, JP;

Akiyoshi Ide, Kasugai, JP;

Hirokazu Nakanishi, Nagoya, JP;

Assignee:

NGK INSULATORS, LTD., Aichi-prefecture, JP;

Attorneys:

Cermak Nakajima & McGowan LLP

Tomoko Nakajima

Primary Examiner:

Gerard Higgins

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 29/16 (2006.01); C30B 29/06 (2006.01); C04B 35/115 (2006.01); C04B 35/111 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/683 (2013.01); C04B 35/111 (2013.01); C04B 35/115 (2013.01); C30B 29/06 (2013.01); H01L 27/12 (2013.01); H01L 29/16 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/5409 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/6023 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/612 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/661 (2013.01); C04B 2235/662 (2013.01); C04B 2235/945 (2013.01); C04B 2235/963 (2013.01); Y10T 428/21 (2015.01); Y10T 428/219 (2015.01); Y10T 428/24777 (2015.01);
Abstract

In a handle substrate for a composite wafer for a semiconductor, particles from the wafer with a notch formed therein are reduced. The handle substrateA orB for the composite wafer for the semiconductor is formed of a polycrystalline ceramic sintered body, and includes a notchA orB in its outer peripheral portion. The notch is formed with an as-sintered surface.

Find Patent Forward Citations

Takagaki, Tatsuro. (2016). Handle substrate and composite wafer for semiconductor device (U.S. Patent No. 9390955). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9390955

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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