logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9390942 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Mar. 14, 2013

Method, system, and apparatus for preparing substrates and bonding semiconductor layers to substrates

Applicant:

Peregrine Semiconductor Corporation, San Diego, CA (US);

Inventors:

Hiroshi Domyo, San Diego, CA (US);

Michael McCafferty, San Diego, CA (US);

Alain Duvallet, San Diego, CA (US);

Masaki Sato, San Diego, CA (US);

Christopher O'Brien, San Diego, CA (US);

Anthony Mark Miscione, Ramona, CA (US);

George Imthurn, San Diego, CA (US);

Assignee:

Peregrine Semiconductor Corporation, San Diego, CA (US);

Attorneys:

Jaquez Land Greenhaus LLP

Martin J. Jaquez, Esq.

Primary Examiner:

Thinh T Nguyen

Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 21/322 (2006.01); H01L 21/02 (2006.01); H01L 29/36 (2006.01); H01L 23/31 (2006.01); H01L 21/762 (2006.01); H01L 23/26 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3226 (2013.01); H01L 21/02052 (2013.01); H01L 21/76256 (2013.01); H01L 21/3221 (2013.01); H01L 21/76251 (2013.01); H01L 23/26 (2013.01); H01L 23/3128 (2013.01); H01L 29/36 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Embodiments of preparing substrates for subsequent bonding with semiconductor layer are described herein. A substrate may be prepared with one or more chemicals or a sacrificial layer to limit or remove substrate contaminants and reduce substrate surface damage. Other embodiments may be described and claimed.

Find Patent Forward Citations

Domyo, Hiroshi. (2016). Method, system, and apparatus for preparing substrates and bonding semiconductor layers to substrates (U.S. Patent No. 9390942). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9390942

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…