The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Mar. 14, 2013
Applicant:
Peregrine Semiconductor Corporation, San Diego, CA (US);
Inventors:
Hiroshi Domyo, San Diego, CA (US);
Michael McCafferty, San Diego, CA (US);
Alain Duvallet, San Diego, CA (US);
Masaki Sato, San Diego, CA (US);
Christopher O'Brien, San Diego, CA (US);
Anthony Mark Miscione, Ramona, CA (US);
George Imthurn, San Diego, CA (US);
Assignee:
Peregrine Semiconductor Corporation, San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 21/322 (2006.01); H01L 21/02 (2006.01); H01L 29/36 (2006.01); H01L 23/31 (2006.01); H01L 21/762 (2006.01); H01L 23/26 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3226 (2013.01); H01L 21/02052 (2013.01); H01L 21/76256 (2013.01); H01L 21/3221 (2013.01); H01L 21/76251 (2013.01); H01L 23/26 (2013.01); H01L 23/3128 (2013.01); H01L 29/36 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Embodiments of preparing substrates for subsequent bonding with semiconductor layer are described herein. A substrate may be prepared with one or more chemicals or a sacrificial layer to limit or remove substrate contaminants and reduce substrate surface damage. Other embodiments may be described and claimed.