The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Jul. 15, 2014
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Sim Chung Kang, Suwon-Si, KR;

Seung Hee Yoo, Suwon-Si, KR;

Kyung Pyo Hong, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 2/065 (2013.01); H01G 4/2325 (2013.01); H01G 4/12 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A multilayer ceramic electronic component may include a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor containing carbon nanotubes, and a base resin. When the multilayer ceramic electronic component is heat-tested by raising a temperature of the multilayer ceramic electronic component from room temperature to about 900° C. at a rate of about 10° C./min, a weight of the multilayer ceramic electronic component decreases by about 0.33% to about 2.19%.


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