The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Oct. 03, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Seok Hyun Yoon, Kimpo, KR;

Jong Bong Lim, Changwon, KR;

Jae Sung Park, Anyang, KR;

Doo Young Kim, Suwon, KR;

Chang Hoon Kim, Yongin, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); C04B 35/468 (2006.01); H01G 4/30 (2006.01); C04B 35/465 (2006.01); C04B 35/49 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); C04B 35/465 (2013.01); C04B 35/4682 (2013.01); C04B 35/49 (2013.01); H01G 4/30 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3229 (2013.01); C04B 2235/3239 (2013.01); C04B 2235/3241 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3272 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/78 (2013.01); C04B 2235/788 (2013.01);
Abstract

A dielectric composition includes a base main component including Ba and Ti and an accessory component, wherein a ratio of domain width/grain size of the dielectric composition is in the range of 0 to 0.2, a multilayer ceramic capacitor using the same, and a method for manufacturing a multilayer ceramic capacitor. It is possible to provide a dielectric composition that can implement a higher dielectric constant and good high temperature withstand voltage characteristics in the same grain size condition. It is expected that this effect can be effectively applied to the development of ultra high capacity MLCCs having a thin dielectric by implementing the same capacity while increasing the thickness of the dielectric than the case of applying the conventional dielectric material.


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