The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

May. 22, 2013
Applicants:

Douglas Brockett, Menlo Park, CA (US);

Peter Privitera, San Francisco, CA (US);

Jon Carver, Millbrae, CA (US);

Joshua Druker, Redwood City, CA (US);

Tad Hunt, Sunnyvale, CA (US);

Ramesh Balan, Cupertino, CA (US);

Inventors:

Douglas Brockett, Menlo Park, CA (US);

Peter Privitera, San Francisco, CA (US);

Jon Carver, Millbrae, CA (US);

Joshua Druker, Redwood City, CA (US);

Tad Hunt, Sunnyvale, CA (US);

Ramesh Balan, Cupertino, CA (US);

Assignee:

Exablox Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 1/187 (2013.01); G06F 1/181 (2013.01); Y10T 29/49826 (2015.01); Y10T 29/53274 (2015.01);
Abstract

An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, a first ejection actuator coupled to the door and configured to move simultaneously with the door, a second ejection actuator including a spring member connected to the second ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the second ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the second ejection actuator along the chassis enclosure.


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