The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Apr. 10, 2013
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Inventors:

Xinyou Ji, Beijing, CN;

Jian Guo, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/13 (2006.01); G01R 31/02 (2006.01); G09G 3/00 (2006.01); G01N 21/958 (2006.01); G02F 1/1362 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1309 (2013.01); G01N 21/958 (2013.01); G01R 31/02 (2013.01); G02F 1/136259 (2013.01); G09G 3/006 (2013.01); G01N 2021/9513 (2013.01); G01N 2201/062 (2013.01); G02F 2001/136254 (2013.01); G02F 2001/136268 (2013.01); H01L 2225/06596 (2013.01);
Abstract

The present disclosure provides an array substrate comprising a structure to be detected disposed on a base substrate. An additional layer for detecting the structure to be detected is broken is disposed below the structure to be detected. The additional layer has a color different from that of the structure to be detected and a same pattern shape as that of the structure to be detected. The present disclosure also provides a detecting method and detecting apparatus of the array substrate described above. According to the array substrate, the detecting method and the detecting apparatus of the present disclosure, an early detection of the breakage defect occurred during the fabrication process of the array substrate can be achieved so as to discover and eliminate those defects as early as possible, which improves throughput and yield.


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