The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Oct. 14, 2011
Applicants:
Dong Seon Uh, Uiwang-si, KR;
Hyun Hee Namkung, Uiwang-si, KR;
Kwang Jin Jung, Uiwang-si, KR;
Jin Seong Park, Uiwang-si, KR;
Jae Sun Han, Uiwang-si, KR;
Inventors:
Dong Seon Uh, Uiwang-si, KR;
Hyun Hee Namkung, Uiwang-si, KR;
Kwang Jin Jung, Uiwang-si, KR;
Jin Seong Park, Uiwang-si, KR;
Jae Sun Han, Uiwang-si, KR;
Assignee:
CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 1/10 (2015.01); C09J 9/02 (2006.01); C09J 163/10 (2006.01); C09J 175/14 (2006.01);
U.S. Cl.
CPC ...
G02B 1/105 (2013.01); C09J 9/02 (2013.01); C09J 163/10 (2013.01); C09J 175/14 (2013.01); Y10T 428/31504 (2015.04); Y10T 428/31511 (2015.04);
Abstract
An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.