The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Nov. 12, 2013
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Ihtesham H. Chowdhury, Sunnyvale, CA (US);
Henry H. Lam, San Jose, CA (US);
Derek W. Wright, San Francisco, CA (US);
Amaury J. Heresztyn, Woodside, CA (US);
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 21/06 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); G06F 1/20 (2006.01); F28F 21/02 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
F28F 21/06 (2013.01); G06F 1/203 (2013.01); H01L 23/373 (2013.01); H01L 23/433 (2013.01); F28F 21/02 (2013.01); F28F 2013/006 (2013.01); F28F 2255/02 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.