The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9388838 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 12, 2016

Filed:

Apr. 04, 2013
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Steven E. Morris, Fair Haven, MI (US);

Jennifer P. Lawall, Waterford, MI (US);

Joel Colombo, Howell, MI (US);

Toure D. Lee, Birmingham, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16B 19/00 (2006.01); B21J 15/02 (2006.01); F16B 19/06 (2006.01); B21K 25/00 (2006.01); B21J 15/00 (2006.01); F16B 5/06 (2006.01); F16B 5/07 (2006.01);
U.S. Cl.
CPC ...
F16B 19/002 (2013.01); B21J 15/00 (2013.01); B21J 15/02 (2013.01); B21K 25/00 (2013.01); F16B 5/0635 (2013.01); F16B 5/07 (2013.01); F16B 19/06 (2013.01); Y10T 29/49956 (2015.01);
Abstract

An elastic retaining assembly for matable components includes a first component having a first surface. Also included is a second component having a second surface and a third surface, wherein the second component is configured to be mated with the first component. Further included is a receiving feature formed proximate an engagement side of the second component and defining a pin perimeter surface. Yet further included is an elastically deformable pin operatively coupled to, and extending away from, the first surface, wherein the elastically deformable pin is formed of an elastically deformable material to elastically deform proximate the pin perimeter surface upon contact with the receiving feature.


Find Patent Forward Citations

Loading…