The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Jul. 15, 2014
Applicant:

Lg Chem. Ltd., Seoul, KR;

Inventors:

Seung Hun Yang, Daejeon, KR;

Ho Yeul Choi, Daejeon, KR;

Jung Su Han, Daejeon, KR;

Byoung Yun Kim, Daejeon, KR;

Jung Eun Kim, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 39/00 (2006.01); C08L 9/04 (2006.01); C08F 236/12 (2006.01); C08L 13/02 (2006.01); C08J 5/02 (2006.01); B29C 41/00 (2006.01); B29C 41/14 (2006.01); B29D 99/00 (2010.01); C08F 228/02 (2006.01); B29K 9/00 (2006.01);
U.S. Cl.
CPC ...
C08L 9/04 (2013.01); B29C 41/003 (2013.01); B29C 41/14 (2013.01); B29D 99/0067 (2013.01); C08F 236/12 (2013.01); C08J 5/02 (2013.01); C08L 13/02 (2013.01); B29K 2009/00 (2013.01); C08F 228/02 (2013.01); C08J 2313/02 (2013.01);
Abstract

Provided are a latex for dip molding, a composition for dip molding, a preparation method of a dip molded product, and a dip molded product prepared thereby. The latex for dip molding includes a conjugated diene monomer, an ethylenically unsaturated nitrile monomer, and an ethylenically unsaturated acid monomer, wherein the latex further includes sodium methallyl sulfonate as a copolymerizable ionic monomer. A dip molded product having excellent tensile strength, elongation, and touch may be obtained from a composition using the latex according to the present invention, and the generation of limitations, such as non-uniformity of physical properties and difficulties in product management, may be prevented.


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