The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Feb. 09, 2011
Applicants:

Yun Bong Kim, Daejeon, KR;

Won Kook Kim, Daejeon, KR;

Yang Go Kang, Daejeon, KR;

Jin Woo Kim, Daejeon, KR;

Dong Joo Kwon, Daejeon, KR;

Mu Seon Ryu, Seoul, KR;

Inventors:

Yun Bong Kim, Daejeon, KR;

Won Kook Kim, Daejeon, KR;

Yang Go Kang, Daejeon, KR;

Jin Woo Kim, Daejeon, KR;

Dong Joo Kwon, Daejeon, KR;

Mu Seon Ryu, Seoul, KR;

Assignee:

LG Hausys, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); B29C 45/14 (2006.01); C09D 163/00 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14811 (2013.01); C09D 163/00 (2013.01); B29K 2995/0087 (2013.01); C08F 2222/1013 (2013.01); C08F 2810/20 (2013.01);
Abstract

A hard coating forming method is disclosed that can form a hard coating on surfaces of various manufactured goods including resin products and wood products. The method includes transcribing a coating layer of a sheet having a substrate and the coating layer formed on the substrate, the coating layer containing a thermoset product of a resin composition comprising a resin having an epoxy group and a (meth)acryloyl group and a thiol based curing agent; delaminating the substrate from the sheet; and irradiating light to the coating layer to cure the coating layer.


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