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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9387608 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Nov. 14, 2007

Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

Applicants:

Hayato Kotani, Tsukuba, JP;

Naoyuki Urasaki, Chikusei, JP;

Kanako Yuasa, Saitama, JP;

Akira Nagai, Hitachi, JP;

Mitsuyoshi Hamada, Abiko, JP;

Inventors:

Hayato Kotani, Tsukuba, JP;

Naoyuki Urasaki, Chikusei, JP;

Kanako Yuasa, Saitama, JP;

Akira Nagai, Hitachi, JP;

Mitsuyoshi Hamada, Abiko, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Robert Sellers

Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08K 7/24 (2006.01); C08K 7/28 (2006.01); C08L 63/02 (2006.01); C08L 63/06 (2006.01); B29C 45/02 (2006.01); C08K 3/00 (2006.01); C08L 63/00 (2006.01); B29C 45/00 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); B29L 11/00 (2006.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 45/0001 (2013.01); C08G 59/4014 (2013.01); C08G 59/4215 (2013.01); C08K 3/0033 (2013.01); C08K 3/2279 (2013.01); C08K 7/24 (2013.01); C08K 7/28 (2013.01); C08L 63/00 (2013.01); C08L 63/06 (2013.01); B29L 2011/00 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/2244 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

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