The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Jun. 05, 2015
Applicant:

Enplas Corporation, Saitama, JP;

Inventors:

Koichi Ono, Saitama, JP;

Ken Kitamoto, Saitama, JP;

Assignee:

Enplas Corporation, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G01N 15/06 (2006.01); G01N 33/00 (2006.01); G01N 33/48 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502715 (2013.01); B01L 3/502707 (2013.01); B01L 2200/0689 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/123 (2013.01); B01L 2300/16 (2013.01); B01L 2300/18 (2013.01); B01L 2300/1827 (2013.01); B01L 2400/0406 (2013.01);
Abstract

A fluid handling device includes a substrate, a film and a conductive layer. The substrate includes a through hole or a recess. The film includes first, second and third regions. The conductive layer is disposed on one surface of the film across the first, second and third regions. The first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part, and that a part of the conductive layer is exposed to the inside of the housing part. The second region of the film is bent such that the conductive layer is located on an outside. The third region of the film is bonded to the first region of the film such that the conductive layer is exposed to the exterior.


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