The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Aug. 31, 2011
Applicants:

Arihiro Matsunaga, Tokyo, JP;

Hitoshi Sakamoto, Tokyo, JP;

Minoru Yoshikawa, Tokyo, JP;

Inventors:

Arihiro Matsunaga, Tokyo, JP;

Hitoshi Sakamoto, Tokyo, JP;

Minoru Yoshikawa, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); F28F 13/06 (2006.01); F28F 3/02 (2006.01); F28F 13/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20363 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28F 3/02 (2013.01); F28F 13/06 (2013.01); F28F 13/18 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A vapor phase cooling apparatus () includes: a housing () including a heat receiver () configured to receive heat generated by an electronic component () that is a heat generating source, the electronic component () being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink () and a second heat sink () that are disposed on the +Y side and the −Y side from the electronic component () and that dissipate heat to the outside. Both ends of the first heat sink () and the second heat sink () in X direction extend further along the surface on the +Z side than both ends of the heat receiver () in X direction.


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