The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Apr. 12, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Joong-hyuk Kim, Seoul, KR;

Yong-wan Jin, Seoul, KR;

Young-ki Hong, Anyang-si, KR;

Sung-gyu Kang, Suwon-si, KR;

Seung-ho Lee, Suwon-si, KR;

Jin-seok Hong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 3/12 (2006.01); C23C 22/83 (2006.01); C23C 22/78 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1258 (2013.01); C23C 22/78 (2013.01); C23C 22/83 (2013.01); H05K 3/125 (2013.01); H05K 3/1208 (2013.01); H05K 2201/09036 (2013.01);
Abstract

Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.


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