The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Nov. 06, 2012
Applicant:

Toray Engineering Co., Ltd., Tokyo, JP;

Inventors:

Takashi Iwade, Otsu, JP;

Shinya Izumida, Otsu, JP;

Kazuyuki Shishino, Otsu, JP;

Kiyohito Yamamoto, Otsu, JP;

Shigeru Tohno, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); H05K 3/1208 (2013.01); H05K 3/1241 (2013.01); H05K 1/0296 (2013.01); H05K 2201/09781 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/1173 (2013.01);
Abstract

With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.


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