The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9386696 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 05, 2016

Filed:

Dec. 20, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shinichiro Banba, Nagaokakyo, JP;

Yutaka Fukuda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/16 (2006.01); G01R 1/20 (2006.01); H05K 1/03 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); G01R 1/203 (2013.01); H05K 1/0306 (2013.01); H05K 1/167 (2013.01); H05K 3/4614 (2013.01); G01R 3/00 (2013.01); H05K 3/429 (2013.01); H05K 3/4629 (2013.01); H05K 2201/0269 (2013.01);
Abstract

A multilayer ceramic substrate includes a ceramic element body including a plurality of stacked ceramic layers, a resistor including a resistance film disposed between the ceramic layers, and a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance film. The resistance film and the lead via conductor both contain, for example, Ni and Cu that constitute an alloy resistive material. A concentration of the Ni component in the lead via conductor has a gradient structure that is comparatively high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a second end portion opposite therefrom.


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Banba, Shinichiro. (2016). Multilayer ceramic substrate and manufacturing method therefor (U.S. Patent No. 9386696). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9386696

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