The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Nov. 12, 2010
Applicants:

James Macdonald, Chandler, AZ (US);

William Mckinzie, Iii, Fulton, MD (US);

Walter Parmon, Chandler, AZ (US);

Lawrence Rubin, Sykesville, MD (US);

Inventors:

James MacDonald, Chandler, AZ (US);

William McKinzie, III, Fulton, MD (US);

Walter Parmon, Chandler, AZ (US);

Lawrence Rubin, Sykesville, MD (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H05K 1/02 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/32 (2006.01); H01Q 9/04 (2006.01); H01Q 13/18 (2006.01); H01Q 15/00 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/3233 (2013.01); H01Q 9/0407 (2013.01); H01Q 13/18 (2013.01); H01Q 15/0086 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/167 (2013.01); H01L 2924/16152 (2013.01); H05K 1/181 (2013.01); H05K 2201/09072 (2013.01); Y10T 29/49016 (2015.01);
Abstract

An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.


Find Patent Forward Citations

Loading…