The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Dec. 28, 2011
Applicant:
Manabu Bonkohara, Kanagawa, JP;
Inventor:
Manabu Bonkohara, Kanagawa, JP;
Assignee:
ZYCUBE CO., LTD., Yokohama-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H05K 7/20 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/34 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49827 (2013.01); H01L 25/0657 (2013.01); H05K 7/2039 (2013.01); H05K 7/20218 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/12044 (2013.01);
Abstract
An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources. An interposercomprises a body having a cavitymaintained in vacuum; insulating layersandformed respectively on upper and lower wallsandof the body; and heat reflecting layersandformed respectively on the insulating layersand. The interposerthermally insulates semiconductor devicesandmounted respectively on upper and lower sides of the interposer