The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Apr. 19, 2013
Applicant:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Inventors:
Daisuke Ohama, Chiyoda-ku, JP;
Akiko Fujiuchi, Chiyoda-ku, JP;
Seiichi Matsumura, Chiyoda-ku, JP;
Atsushi Ito, Chiyoda-ku, JP;
Masaru Imaizumi, Chiyoda-ku, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01J 40/14 (2006.01); H04N 1/193 (2006.01); H04N 1/028 (2006.01); H04N 1/031 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 1/1936 (2013.01); H01L 27/14627 (2013.01); H04N 1/02815 (2013.01); H04N 1/02835 (2013.01); H04N 1/0318 (2013.01); H04N 2201/0081 (2013.01); H04N 2201/0082 (2013.01); H04N 2201/0094 (2013.01); H04N 2201/0246 (2013.01); H04N 2201/02456 (2013.01); H04N 2201/02458 (2013.01); H04N 2201/02462 (2013.01); H04N 2201/02464 (2013.01); H04N 2201/02466 (2013.01); H04N 2201/02481 (2013.01); H04N 2201/02483 (2013.01); H04N 2201/0312 (2013.01); H04N 2201/03112 (2013.01); H04N 2201/03125 (2013.01); H04N 2201/03133 (2013.01); H04N 2201/03141 (2013.01); H04N 2201/03145 (2013.01);
Abstract
An image sensor including: light guides for irradiating light onto an irradiated object; a lens that focuses reflected light that was reflected by the irradiated object; a sensor that receives the reflected light that was focused by the lens; and a housing. The housing houses or holds the light guides, the lens, and the sensor, and is formed by integrating a housing metal portion and a housing resin portion.