The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Feb. 04, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Russell Carlton McMullan, Austin, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 27/12 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 21/84 (2006.01); H01L 21/321 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1203 (2013.01); H01L 21/3212 (2013.01); H01L 21/7624 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 21/84 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/53257 (2013.01); H01L 23/53271 (2013.01);
Abstract

An integrated circuit has a buried interconnect in the buried oxide layer connecting a body of a MOS transistor to a through-substrate via (TSV). The buried interconnect extends laterally past the TSV. The integrated circuit is formed by starting with a substrate, forming the buried oxide layer with the buried interconnect at a top surface of the substrate, and forming a semiconductor device layer over the buried oxide layer. The MOS transistor is formed in the semiconductor device layer so that the body makes an electrical connection to the buried interconnect. Subsequently, the TSV is formed through a bottom surface of the substrate so as to make an electrical connection to the buried interconnect in the buried oxide layer. A body of a transistor is electrically coupled to the TSV through the buried interconnect.


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