The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Aug. 21, 2013
Applicant:
Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;
Inventor:
Takumi Ihara, Tachikawa, JP;
Assignee:
SOCIONEXT INC., Kanagawa, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 21/50 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/50 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor device includes a substrate, a semiconductor chip mounted on the substrate, a plate-like member that is fixed on the semiconductor chip and has a thermal expansion coefficient different from that of the substrate, and a first adhesive that is provided between the substrate and the plate-like member, the first adhesive being connected to the plate-like member and separated from the substrate, or being separated from the plate-like member and connected to the substrate.