The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Jun. 01, 2015
Renesas Electronics Corporation, Kawasaki-shi, JP;
Yoshiharu Kaneda, Kawasaki, JP;
Naoko Taniguchi, Kawasaki, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
A semiconductor device includes a die pad, which includes an upper surface and a lower surface opposite to the upper surface, the upper surface forming a rectangular shape in plain view; a plurality of support pins that support the die pad; a plurality of inner leads arranged around the die pad; a plurality of outer leads connected to each of the inner leads; a semiconductor chip which includes a main surface and a back surface opposite to the main surface and in which a plurality of electrode pads is formed in the main surface. The die pad includes a first side, a second side opposite to the first side, and a third side and a fourth side, which intersect the first and second sides.