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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9385061 B1

PDFFull Text
Date of Patent:
Jul. 05, 2016

Filed:

Aug. 08, 2014

Semiconductor device and method for manufacturing semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Hideyo Nakamura, Matsumoto, JP;

Masafumi Horio, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:

Rossi, Kimms & McDowell LLP

Primary Examiner:

Christine Enad

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/36 (2006.01); H02M 7/00 (2006.01); H01L 25/07 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H01L 23/043 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/08 (2006.01); H01L 25/065 (2006.01); H01L 23/40 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/043 (2013.01); H01L 23/08 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/4334 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/115 (2013.01); H02M 7/003 (2013.01); H05K 7/1432 (2013.01); H05K 7/209 (2013.01); H01L 23/5385 (2013.01); H01L 25/18 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1421 (2013.01);
Abstract

A semiconductor device includes: semiconductor modules in which a circuit board having at least one or more semiconductor chips mounted thereon is sealed with a mold resin material and an attachment hole is formed; main terminal plates that individually connect individual connection terminals of the plurality of semiconductor modules which are arranged in parallel; and a module storage case into which the plurality of the semiconductor modules connected by the main terminal plates are inserted integrally with the main terminal plates from an opening portion and which holds the plurality of semiconductor modules such that the position of the semiconductor modules can be adjusted during attachment and includes attachment insertion holes facing the attachment holes of the semiconductor modules.

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