The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Apr. 06, 2015
Applicant:

Hitachi-kokusai Electric Inc., Tokyo, JP;

Inventors:

Yushin Takasawa, Toyama, JP;

Hajime Karasawa, Toyama, JP;

Yoshiro Hirose, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); H01L 21/314 (2006.01); H01L 21/318 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); C23C 16/50 (2006.01); C23C 14/54 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); C23C 14/542 (2013.01); C23C 16/45527 (2013.01); C23C 16/45531 (2013.01); C23C 16/45542 (2013.01); C23C 16/45544 (2013.01); C23C 16/45546 (2013.01); C23C 16/45557 (2013.01); C23C 16/46 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); C23C 28/36 (2013.01); H01L 21/022 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02112 (2013.01); H01L 21/02126 (2013.01); H01L 21/02145 (2013.01); H01L 21/02153 (2013.01); H01L 21/02161 (2013.01); H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H01L 21/02175 (2013.01); H01L 21/02178 (2013.01); H01L 21/02186 (2013.01); H01L 21/02211 (2013.01); H01L 21/02271 (2013.01); H01L 21/02274 (2013.01); H01L 21/02321 (2013.01); H01L 21/02326 (2013.01); H01L 21/02332 (2013.01); H01L 21/318 (2013.01); H01L 21/3141 (2013.01); H01L 21/3185 (2013.01);
Abstract

Provided is a technique including forming a film on a substrate, the film including a first element and a second element different from the first element, by performing a cycle a predetermined number of times. The cycle includes: forming a first layer including the first element by supplying a gas containing the first element to the substrate, wherein the first layer is a discontinuous layer, a continuous layer, or a layer in which at least one of the discontinuous layer or the continuous layer is overlapped; and forming a second layer including the first element and the second element by supplying a gas containing the second element to the substrate to modify the first layer under a condition where a modifying reaction of the first layer by the gas containing the second element is not saturated.


Find Patent Forward Citations

Loading…