The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Dec. 14, 2011
Applicants:

Nozomi Kimura, Kanagawa, JP;

Keisuke Shimizu, Kanagawa, JP;

Toshio Fukuda, Kanagawa, JP;

Inventors:

Nozomi Kimura, Kanagawa, JP;

Keisuke Shimizu, Kanagawa, JP;

Toshio Fukuda, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); C01B 31/04 (2006.01); B82Y 40/00 (2011.01); H01B 13/00 (2006.01); B82Y 30/00 (2011.01); B32B 38/10 (2006.01); B32B 37/00 (2006.01); H01G 9/20 (2006.01); H01L 51/44 (2006.01);
U.S. Cl.
CPC ...
H01B 13/0036 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 31/0438 (2013.01); C01B 31/0446 (2013.01); C01B 31/0453 (2013.01); B32B 37/025 (2013.01); H01G 9/2031 (2013.01); H01G 9/2059 (2013.01); H01L 51/442 (2013.01); Y10T 156/1072 (2015.01); Y10T 156/1702 (2015.01);
Abstract

[Object] To provide a method for transferring a graphene film, which can transfer a graphene film on a desired substrate with excellent adhesiveness, can effectively prevent defects from being generated in a graphene film and is excellent also in mass productivity, and a method for manufacturing a transparent conductive film. [Solving Means] One layer or a plurality of layers of graphene filmsformed on a first substrateand a second substrateare stuck with a resin layerthat contains less than 1% by weight of a volatile component and has adhesiveness, the first substrateand the second substrateare pressurized to reduce a thickness of the resin layer, the resin layeris cured, after that the first substrateis removed.


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