The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Sep. 10, 2014
Applicant:

Scienbizip Consulting (Shen Zhen) Co., Ltd., Shenzhen, CN;

Inventors:

Chang-Chin Wu, New Taipei, TW;

Ten-Hsing Jaw, New Taipei, TW;

Chin-Yang Wu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/0354 (2013.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 3/03547 (2013.01); G06F 3/044 (2013.01); G06F 2203/04103 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01); Y10T 29/49147 (2015.01);
Abstract

A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions.


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