The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

May. 22, 2013
Applicants:

Ming-fang Tsai, Taipei, TW;

Ming-hsiu Wu, Taipei, TW;

Ching Ho, Taipei, TW;

Yen-chao Huang, Taipei, TW;

Inventors:

Ming-Fang Tsai, Taipei, TW;

Ming-Hsiu Wu, Taipei, TW;

Ching Ho, Taipei, TW;

Yen-Chao Huang, Taipei, TW;

Assignee:

ASUSTeK COMPUTER INC., Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01);
Abstract

A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.


Find Patent Forward Citations

Loading…