The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

May. 08, 2014
Applicants:

Darfon Electronics (Suzhou) Co., Ltd., Suzhou, Jiangsu Province, CN;

Darfon Electronics Corp., Taoyuan, TW;

Inventors:

Liang-Yu Yao, Taoyuan, TW;

Hsin-Cheng Ho, Taoyuan, TW;

Yu-Ching Ting, Taoyuan, TW;

Assignees:

DARFON ELECTRONICS (SUZHOU) CO., LTD., New District, Suzhou, Jiangsu Province, CN;

DARFON ELECTRONICS CORP., Gueishan, Taoyuan, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 11/28 (2006.01); F21V 8/00 (2006.01); H01H 13/83 (2006.01);
U.S. Cl.
CPC ...
G02B 6/0055 (2013.01); G02B 6/0021 (2013.01); G02B 6/0083 (2013.01); H01H 13/83 (2013.01); H01H 2219/044 (2013.01); H01H 2219/062 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49117 (2015.01);
Abstract

A backlit keyboard includes a keyboard module having a plurality of key units and a light guide module including a light guide plate, a metal layer, and an insulation layer. The light guide plate has a light-exit surface and a bottom surface. The metal layer has an upper surface and a lower surface, wherein the upper surface is attached to the bottom surface of the light guide plate. When light is incident onto the upper surface of the metal layer, the light will be reflected back into the light guide plate. When electromagnetic wave reaches the lower surface of the metal layer, the metal layer will shield the electromagnetic wave from propagating. The insulation layer substantially covers the lower surface of the metal layer, wherein at least one ground window is formed in the insulation layer to expose the metal layer.


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