The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Jan. 16, 2014
Applicant:

Kavlico Corporation, Moorpark, CA (US);

Inventors:

Marcos A. Nassar, Los Angeles, CA (US);

Ernest W. Cordan, Mesa, AZ (US);

Mark L. Urban, Ventura, CA (US);

Assignee:

Sensata Technologies, Inc., Attleboro, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/12 (2006.01); G01L 9/00 (2006.01); G01L 1/14 (2006.01); H01G 5/16 (2006.01);
U.S. Cl.
CPC ...
G01L 9/12 (2013.01); G01L 1/148 (2013.01); G01L 9/0016 (2013.01); G01L 9/0072 (2013.01); H01G 5/16 (2013.01); Y10T 29/41 (2015.01);
Abstract

A capacitive pressure transducer of an embodiment of the present invention capacitively couples two electrodes on a substrate with a diaphragm electrode to form a transducing circuit without the need for a physical connection between the electrodes. Embodiments of the present invention have a substrate with a coupling electrode and a sensing electrode and an attached diaphragm with a diaphragm electrode. A spacer positioned between the substrate and the diaphragm provides for a cavity that defines a gap between the sensing electrode and the diaphragm electrode. A dielectric spacer may be positioned over the coupling electrode to increase the capacitance between the coupling electrode and the diaphragm electrode. The capacitive pressure transducer has similar electrical characteristics as existing capacitive pressure transducers, is easier to manufacture, and has long-term reliability and durability improvements brought about by the elimination of mechanical interconnects and additional conductive materials.


Find Patent Forward Citations

Loading…