The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Aug. 21, 2013
Applicants:

Daicel-evonik Ltd., Tokyo, JP;

Daikin Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Mitsuteru Mutsuda, Himeji, JP;

Tatsuki Akashi, Himeji, JP;

Yuki Adachi, Settsu, JP;

Haruhisa Masuda, Settsu, JP;

Assignee:

DAICEL-EVONIK LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 61/00 (2006.01); C08L 61/16 (2006.01); B29C 69/00 (2006.01); C08L 71/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08L 61/16 (2013.01); B29C 69/00 (2013.01); C08L 71/00 (2013.01); B29L 2031/772 (2013.01); C08G 2650/40 (2013.01); C08L 2201/02 (2013.01); C08L 2207/04 (2013.01);
Abstract

A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 μm. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.


Find Patent Forward Citations

Loading…