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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9381717 B1

PDFFull Text
Date of Patent:
Jul. 05, 2016

Filed:

Jan. 22, 2014

Manufacturing method of heat dissipation structure applied to mobile device

Applicant:

Asia Vital Components Co., Ltd., New Taipei, TW;

Inventors:

Chih-Yen Lin, New Taipei, TW;

Chih-Ming Chen, New Taipei, TW;

Assignee:

Asia Vital Components Co., Ltd, New Taipei, TW;

Attorneys:

C. G. Mersereau

Nikolai & Mersereau, P.A.

Primary Examiner:

Michael Wieczorek

Int. Cl.
CPC ...
H01T 14/00 (2006.01); H05H 1/48 (2006.01); B32B 3/30 (2006.01); B32B 15/04 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B32B 3/26 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); B32B 2255/06 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2305/026 (2013.01); B32B 2307/302 (2013.01); B32B 2307/402 (2013.01); B32B 2457/00 (2013.01); Y10T 428/12736 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24999 (2015.04); Y10T 428/249967 (2015.04); Y10T 428/249969 (2015.04); Y10T 428/31678 (2015.04);
Abstract

A manufacturing method of heat dissipation structure applied to mobile device. The heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

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