The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Jan. 12, 2015
Toyoda Gosei Co., Ltd., Kiyosu-shi, Aichi-ken, JP;
Mamoru Kato, Kiyosu, JP;
Takahito Ogiso, Kiyosu, JP;
Kazuo Suzuki, Kiyosu, JP;
Tatsuo Yamada, Kiyosu, JP;
Hiroshi Watarai, Kiyosu, JP;
TOYODA GOSEI CO., LTD., Aichi-pref., JP;
Abstract
A molding die is devised to suppress the formation of a fragile layer, thereby ensuring stable production of a resin molded body having remarkably improved adhesion of a plating film. A plurality of stepped parts are formed so as to be spaced apart from each other on a second die surface which molds a back surface on the side opposite to a design surface to which metal plating is to be applied, along the main flowing direction of a molten resin and in a direction crossing the main flowing direction. Since the flow of the molten resin changes due to the stepped parts and the influence thereof extends even to the vicinity of the design surface, the formation of a fragile layer is suppressed.