The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
May. 16, 2014
Quanta Computer Inc., Taoyuan Shien, TW;
Chi-Hsueh Yang, Keelung, TW;
Ming-Chang Tsai, Taipei, TW;
Wei-Han Chen, New Taipei, TW;
Hsiao-Fan Chang, New Taipei, TW;
QUANTA COMPUTER INC., Guishan Dist., Taoyuan, TW;
Abstract
A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile