The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Mar. 18, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kanta Motoki, Nagaokakyo, JP;

Sayyed Tabib, Nagaokakyo, JP;

Saneaki Ariumi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H05K 1/02 (2006.01); H01G 4/40 (2006.01); H03H 1/00 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0138 (2013.01); H01G 4/40 (2013.01); H03H 7/0115 (2013.01); H05K 1/0233 (2013.01); H03H 2001/0085 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 3/403 (2013.01); H05K 2201/083 (2013.01);
Abstract

A built-in-circuit substrate includes a substrate body, an electrical circuit including inner electrodes provided inside the substrate body and to which an RF signal is input, outer electrodes which are provided on the substrate body so as to be connected to the electrical circuit and which each include an underlying metal layer and a nickel layer covering at least a portion of the underlying metal layer, and a permanent magnet which is arranged on the substrate body. Thus, noise caused by intermodulation distortion generated in the nickel layers of the outer electrodes is prevented.


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